BANC3, Inc. continues its groundbreaking work under the Stimulating Transition for Advanced Microelectronics Packaging [STAMP] program to provide its software-defined receiver (SDRX) products on Intel's latest Multichip Packages. As part of the Department of War's (DoW's) broader digital modernization efforts to leverage the best commercial technologies for military applications, this program provides a new set of advanced capabilities to facilitate the accelerated transition of Intel's Multichip Packages into current DoW programs of record across the Defense Industrial Base.
BANC3 uses Intel A-Tile Direct RF data converter tiles and Intel F-Tile advanced Serializer/Deserializer tiles connected to high-performance, low power Intel® Agilex™ FPGAs in the chipsets. BANC3 is a leading provider of next-generation radio frequency (RF) spectrum monitoring, currently supporting National Reconnaissance Office (NRO) payload launch missions to combat the rising threat to US satellites. BANC3 is a developer and manufacturer of extremely wide instantaneous bandwidth software-defined receivers for radio frequency spectrum monitoring.
